| 摘要 |
PROBLEM TO BE SOLVED: To provide an assembly for adjusting a temperature of a heating target such as a semiconductor substrate, a metal/ceramic mold or other heating targets such as degassing and annealing which needs a temperature adjustment and for supporting the heating target. SOLUTION: In an application example, the assembly is composed of a heating target supporting body to support the heating target, a ceramic heating body to heat the heating target at least up to a temperature of 300°C, a first heat conductive layer arranged between a substrate supporting body and the ceramic heating layer and a second layer arranged below the ceramic heating layer. In a heater assembly, both of the first layer and the second layer have an elastic modulus of 5 GPa or less and supply continuously a uniform and excellent heating to the substrate and energize the ceramic heating layer without damaging the ceramic layer. COPYRIGHT: (C)2008,JPO&INPIT
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