Manufacturing Method of Semiconductor Apparatus

摘要

A manufacturing method of a semiconductor apparatus, comprising the steps of: forming a plurality of leads corresponding to a plurality of semiconductor apparatuses on an electrically conductive sheet; disposing a plurality of semiconductor elements in predetermined positions of the electrically conductive sheet; connecting between a bonding pad of a semiconductor element and a lead by a bonding wire, the semiconductor element being included in the plurality of semiconductor elements and the lead being included in the plurality of leads; curving the bonding wire toward an upstream side of a flow path of resin flowing into a metal mold at a time of resin sealing; and resin-sealing the semiconductor element, the lead, and the bonding wire.