| 摘要 |
A described embodiment of the invention is a semiconductor device (500) with a first (500a) and a second (500b) surface, a package including a plastic molding compound (501), and a semiconductor chip (502) inside the package. A first metal sheet (510) covers at least portions of the first package surface, has a thickness (510a), and is preferably made of copper to operate as a heat spreader. At least one metal connector (511) is in contact with the sheet, has the same thickness as the sheet, and is shaped to be operable as a mechanical spring between sheet and chip. An opening (512) in the sheet is located adjacent to the connector and filled with molding compound. A second metal sheet (520) covers at least portions of the second package surface and is connected to the chip. |
