发明名称 DEPOSITION APPARATUS AND METHOD FOR OPERATING THE SAME
摘要 <p>[PROBLEMS] To remove materials deposited on an inner surface and the like of a processing chamber of a vapor deposition apparatus without opening the processing chamber. [MEANS FOR SOLVING PROBLEMS] A deposition apparatus (13) is provided for performing a film forming process to a subject (G) to be processed by vapor deposition. The vapor deposition apparatus is provided with a deposition head (65) for supplying the subject (G) with a vapor of the film forming material; vapor generating sections (70-72) for vaporizing the film forming material; a cleaning gas generating section (86) for generating a cleaning gas; a vapor supply piping (81-83) for supplying the deposition head (65) with the vapor of the film forming material from the vapor generating sections (70-72); and a cleaning gas supply piping (87) for supplying the deposition head (65) with the cleaning gas from the cleaning gas generating section (86). The vapor supply piping (81-83) and the cleaning gas supply piping (87) are provided with on-off valves (75-78).</p>
申请公布号 WO2008038822(A1) 申请公布日期 2008.04.03
申请号 WO2007JP69185 申请日期 2007.10.01
申请人 TOKYO ELECTRON LIMITED;KAWAKAMI, SATORU 发明人 KAWAKAMI, SATORU
分类号 C23C14/24;C23C14/00;H01L51/50;H05B33/10 主分类号 C23C14/24
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