| 摘要 |
A semiconductor package is provided to easily wire-bond a pad in an edge region with a circuit pattern of a PCB(Printed Circuit Board) by preventing the pad from being overlapped with a solder ball. A semiconductor chip(200) includes a center pad and edge pads. A first substrate(300) includes first and second apertures and first and second bonding pads. The first and second apertures expose the center and edge pads, respectively. The first bonding pad is connected to the center pads through the first aperture by a first conductive wire. The second bonding pad is connected to the edge pads through the second aperture by a second conductive wire. A second substrate(400) includes third and fourth bonding pads(410,420). The third bonding pad is formed on a first surface, which faces the first substrate, and connected to the first and second bonding pads. The fourth bonding pad is formed on a second surface, which is opposed to the first surface, and electrically connected to the third bonding pad. A conductive ball(370) couples the first and second bonding pads with the third bonding pad. |
