发明名称 METHOD OF PRODUCING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of producing a semiconductor device having a satisfactory quality insulating film by preventing mixture of carbon, even when film formation is to be executed under a low-temperature condition, using TMS (tetramethylsilane) for a plasma CVD method. SOLUTION: In the method of producing a semiconductor device having an insulating film formed in a low temperature condition using TMS, the insulating film is formed by a plasma CVD method at a substrate temperature of a room temperature-250°C using TMS as a gas of a material of the insulating film and nitrous oxide (N<SB>2</SB>O) as an oxide gas. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078512(A) 申请公布日期 2008.04.03
申请号 JP20060258080 申请日期 2006.09.22
申请人 KOCHI PREFECTURE SANGYO SHINKO CENTER;CASIO COMPUT CO LTD 发明人 FURUTA HIROSHI;HIRAMATSU TAKAHIRO;MATSUDA TOKIYOSHI;FURUTA MAMORU;HIRAO TAKASHI
分类号 H01L21/31;H01L21/316 主分类号 H01L21/31
代理机构 代理人
主权项
地址