发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device that crystallizes a high dielectric film by suppressing thermal budget. SOLUTION: The method for manufacturing a semiconductor device includes a step for forming a first film formed of a material having a higher conductance than that of silicon oxide on a substrate, a step for crystallizing the first film by heating, a step for reducing the thickness of the crystallized first film, and a step for forming a second film on the thinned first film is provided. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078580(A) 申请公布日期 2008.04.03
申请号 JP20060259313 申请日期 2006.09.25
申请人 TOSHIBA CORP 发明人 NISHITANI KAZUTO;YABUHARA HIDEHIKO
分类号 H01L21/8247;H01L27/115;H01L29/788;H01L29/792 主分类号 H01L21/8247
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