发明名称 Frame structure for supporting a surface mount device light emitting diode used as a side light source
摘要 A frame structure includes a first metallic frame, a second metallic frame, and a plastic housing. The first metallic frame has extension portions extending outwardly, and the first metallic frame is separately positioned from the second metallic frame. The first metallic frame and the second metallic frame respectively have different electrical polarities. The plastic housing is connected with the first metallic frame and the second metallic frame, and the plastic housing and the two extension portions form a receiving space so the two extension portions are positioned at two ends of the plastic housing. The plastic housing receives the LED die and a packaging layer. The extension portions expose out of the plastic housing or are nestled within the plastic housing. The frame structure has a good efficiency of heat dissipation because the metal is not transparent and efficiency of heat dissipation is high without light leakage.
申请公布号 US2008080194(A1) 申请公布日期 2008.04.03
申请号 US20060601745 申请日期 2006.11.20
申请人 SU WEN-LUNG 发明人 SU WEN-LUNG
分类号 F21V15/00;H01L33/48;H01L33/62 主分类号 F21V15/00
代理机构 代理人
主权项
地址