发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
<p>A photosensitive resin composition comprising 100 parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more aromatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.</p> |
申请公布号 |
KR20080030115(A) |
申请公布日期 |
2008.04.03 |
申请号 |
KR20087005344 |
申请日期 |
2006.09.01 |
申请人 |
ASAHI KASEI EMD CORPORATION;PI R&D CO., LTD. |
发明人 |
KANADA TAKAYUKI;HANAHATA HIROYUKI;JIN XINGZHOU;WAKI SHUZO |
分类号 |
G03F7/039 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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