发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <p>A photosensitive resin composition comprising 100 parts by mass of polycondensate (A) having a structure resulting from dehydration condensation between one or two or more tetracarboxylic acid dianhydride and one or two or more aromatic diamines having mutually ortho-positioned amino and phenolic hydroxyl groups and 1 to 100 parts by mass of photosensitive diazonaphthoquinone compound (B), wherein the polycondensate (A) has a weight average molecular weight of 3000 to 70,000.</p>
申请公布号 KR20080030115(A) 申请公布日期 2008.04.03
申请号 KR20087005344 申请日期 2006.09.01
申请人 ASAHI KASEI EMD CORPORATION;PI R&D CO., LTD. 发明人 KANADA TAKAYUKI;HANAHATA HIROYUKI;JIN XINGZHOU;WAKI SHUZO
分类号 G03F7/039 主分类号 G03F7/039
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