| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small electronic component comprising an MEMS element and an ASIC, which connects junction electrodes of the MEMS element and the ASIC even if they do not correspond to each other on a one-to-one basis, and avoids damage of the MEMS element caused by wire bonding, and also to provide a composite electronic component composed of the electronic component. <P>SOLUTION: The electronic component has a structure formed of the MEMS element 10 and the ASIC 30 electrically/mechanically connected to each other. Each of the MEMS element 10 and the ASIC 30 has a rectangular plate-like shape as a whole, and has the junction electrodes 26 on one main surface. The electronic component has a wire-rearranging layer 20 which has the junction electrodes 26 to be connected to the junction electrodes 26 of the MEMS element 10, on a first surface, the junction electrodes 26 to be connected to the junction electrodes 26 of the ASIC 30, on a second surface opposite to the first surface, and a wiring for conducting between the junction electrodes 26 on the first surface and the junction electrodes 26 on the second surface. The wire-rearranging layer 20 is interposed between the MEMS element 10 and the ASIC 30. The electronic component has bumps 27, which are formed on an external terminal pad 25 on the wire-rearranging layer 20 and have a height higher than that of the ASIC 30. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
