发明名称 SUBSTRATE TREATMENT APPARATUS AND METHOD OF ATTACHING AND DETACHING REACTION CONTAINER
摘要 <p><P>PROBLEM TO BE SOLVED: To maintain a reaction container without changing the height of an apparatus and without changing the size of the reaction container. <P>SOLUTION: The substrate treatment apparatus is provided with the reaction container 207 having a treatment chamber 201 for treating a substrate therein; a heading device for heating the substrate from the external peripheral side of the reaction container 207; a lid for closing the processing chamber 201; an attaching/detaching jig 400 placed on the lid when the reaction container 207 is attached and detached to and from the heating device; and a supporting section provided at the upper side from the lower end of the reaction container 207 of the internal side of the reaction container 207, and made to abut on the upper surface of the attaching/detaching jig 400 when the reaction container 207 is attached and detached to and from the heating device. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008078546(A) 申请公布日期 2008.04.03
申请号 JP20060258660 申请日期 2006.09.25
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 SHIBATA TAKESATO;TATSUTA MASAHIRO
分类号 H01L21/205;C23C16/44;H01L21/22;H01L21/31 主分类号 H01L21/205
代理机构 代理人
主权项
地址