| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable a flexible wiring substrate to be removed quickly and easily without causing any damage such as solder cracking, disconnection, etc., the flexible wiring substrate on which electronic parts are mounted. <P>SOLUTION: The flexible wiring substrates 1 are positioned and retained at a predetermined position of a carrier jig to whose flexible carrier sheet 2's surface a sticky layer 3 is prepared, and is carried to an electronic parts mounting position. After that, the flexible wiring substrate 1, to which electronic parts 9 have been mounted, is separated by inflecting the carrier sheet 2, thus removing it from the carrier sheet 2. <P>COPYRIGHT: (C)2008,JPO&INPIT |
