发明名称 CONNECTION STATE MANAGEMENT SYSTEM FOR SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a connection state management system for substrate treating devices that can improve maintainability. SOLUTION: The connection state management system 300 comprises device controllers 270 which are provided to a plurality of substrate treating devices 100 processing wafers 200 respectively and control the respective substrate treating devices 100, and a monitor server 280 which is electrically connected to the respective device controllers 270 for the substrate treating devices 100 through LAN cables 292 and a hub 293. The monitor server 280 has a display screen 314 for displaying states of connections between at least the respective substrate treating devices 100 and monitor server 280 through the LAN cables 292 and hub 293, and a display screen 314 displaying a detailed state of a connection of an element specified by specifying at least one element among the monitor server 280, the respective substrate treating devices 100, LAN cables 292, and hub 293. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078458(A) 申请公布日期 2008.04.03
申请号 JP20060257187 申请日期 2006.09.22
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 NAKANO MINORU
分类号 H01L21/02;H01L21/027;H01L21/31 主分类号 H01L21/02
代理机构 代理人
主权项
地址