| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for inspecting via holes and wiring arranged on the surface and in the inner part of a substrate and a conductive paste filling state, in a substrate whose via holes are filled with a conductive paste, at low cost. SOLUTION: An inspection method includes a process for making one surface of the substrate tightly contact a heating or cooling mechanism so as to heat or cool the surface; and a process for detecting the temperature of an electrode on a second surface which is different from the heated or cooled first surface so as to determine whether a part between the electrodes arranged on both the connection surfaces is connected normally, based on the detected temperature. An inspection device of the method is also provided. COPYRIGHT: (C)2008,JPO&INPIT
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