| 摘要 |
PROBLEM TO BE SOLVED: To provide a thickness measuring method in grinding work to precisely grind a workpiece in desired thickness by restraining abrasion of a probe making contact with a chuck table to be self-ground. SOLUTION: Thickness measurement of a wafer 1 is carried out only at an initial stage and a finishing stage, the thickness measurement is interrupted by separating a standard probe 51a of a standard side height gage 51 from an upper surface of the chuck table 20 at practical grinding time between the initial stage and the finishing stage, and time of the standard probe 51a making contact with the upper surface of the chuck table 20 is extensively reduced. COPYRIGHT: (C)2008,JPO&INPIT
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