发明名称 METHOD OF RECOVERING MATERIAL AND MATERIAL RECOVERING APPARATUS
摘要 <p>A method of material recovery in which a glass substrate having an adherend attached to at least one major surface thereof is provided and the adherend is removed from the glass substrate to thereby recover the glass substrate. The method includes the step (A) of breaking portion of the glass substrate into glass splinters and the step (B) of bombarding the adherend with the glass splinters to thereby detach and remove the adherend from the glass substrate. By virtue of this method, there can be attained not only removal of the adherend attached to the glass substrate at low cost but also enhancement of glass substrate yield.</p>
申请公布号 WO2008038665(A1) 申请公布日期 2008.04.03
申请号 WO2007JP68680 申请日期 2007.09.26
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;IWAMOTO, HIROSHI;TANI, YOSHIYUKI 发明人 IWAMOTO, HIROSHI;TANI, YOSHIYUKI
分类号 B09B5/00;B09B3/00;B24C1/08;H01J9/50;H01J11/02 主分类号 B09B5/00
代理机构 代理人
主权项
地址