| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-circuit board, which is equipped with a heat dissipating structure that has a heat dissipating solder layer on the back side of an electronic part and dissipates heat to the other side through a viahole, and which is capable of eliminating a manufacturing trouble due to a solder ball generated at the other-side opening of the viahole. <P>SOLUTION: In the double-sided printed circuit board, a heat dissipating soldered land is provided to its part that serves as a mounting surface of an electronic part; a solder absorbing land is provided to the other opposed surface; a viahole, whose end openings are opened at the heat dissipating soldered land and solder absorbing land respectively, is provided; a molten solder introduced through the opening of the viahole is spread at the solder absorbing land so as to restrain a solder ball from being produced, and a cream solder is applied onto the surface of the solder absorbing land so as to embed the above solder and to form a land layer. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
