| 摘要 |
PROBLEM TO BE SOLVED: To improve a pinch-holding mechanism of a protective film bonding device for a printed circuit board. SOLUTION: In the protective film bonding device, a protective thin film feeder 2, a protective film cutter base 4, and a protective film adhering stand 5 pressing the protective film to the board are arranged in order toward a printed circuit board A transferred while facing a printed circuit board transfer device 6, the pinch-holding mechanism 8 arranged behind the adhering stand at the rear edge holds and pull out a front edge of the board adhered with the thin film through the adhering stand, then feeds it to the following step. Defects generated by transferring the protective film can be reduced as compared with a feeding mechanism using a roller nipping, because the mechanism pinch-holds the front edge of the board and feeds it to the following step. COPYRIGHT: (C)2008,JPO&INPIT
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