| 摘要 |
PROBLEM TO BE SOLVED: To minimize reduction in throughput in a semiconductor device. SOLUTION: A semiconductor substrate treatment device includes a front-end 102 having input/output ports 41a and 41b for transferring a substrate cassette 10 to/from the inside/outside of a housing on the treatment device at two height positions in the vertical direction. A storage position 43 is provided in at least one height position between the input/output ports located at two height positions in the vertical direction. The total of eight cassettes can be accommodated at the front-end of the treatment device by forming each of two storage positions and input/output ports at two different height positions in the vertical direction. In a housing 103 of the treatment device, an internal storage position is formed adjacently to a wafer handling chamber at a certain interval from a cassette storage part having a rotational platform for a housing cassette. The cassettes can be accessed at each of the input/output ports and the internal storage position by using a single cassette handler. COPYRIGHT: (C)2008,JPO&INPIT
|
