| 摘要 |
A photosensitive conductive paste is provided to form a conductor pattern that is dense without any pinhole, has high adhesiveness with a substrate, and does not cause an edge-curl problem. A photosensitive conductive paste comprises (A) a conductive powder, (B) an organic binder, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a glass frit, wherein the glass frit is contained in an amount of 5.1-10% by mass relative to the total weight of the paste. The glass frit has a glass transition point of 470-530 °C, a glass softening point of 550-600 °C, an average particle size(D50) value of 0.2-1.2 micron, and a maximal particle size(Dmax) value of 1.0-4.5 micron.
|
