发明名称 PRINTED WIRING BOARD MANUFACTURING METHOD, PROTECTION SHEET, AND PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method for an easily-manufacturable and inexpensive printed wiring board that is excellent in productivity and solder joint performance, a protection sheet applied to the manufacturing method, and a printed wiring board provided with the protection sheet. SOLUTION: The manufacturing method is used for manufacturing the printed wiring board 10 which has a laminated structure formed by laminating a conductor layer 11 and an insulating resin 12 and in which a solder joint terminal 11A is formed at the conductor layer 11 arranged on the outermost layer. A solder resist 13 is formed on the conductor layer 11 arranged on the outermost layer so as to expose the solder joint terminal 11A and to surround the solder joint terminal 11A. The protection sheet 15 is thermally press-bonded or arranged by a heat-roller lamination method on the solder resist 13 so as to cover at least the solder joint terminal 11A. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008078384(A) 申请公布日期 2008.04.03
申请号 JP20060255770 申请日期 2006.09.21
申请人 TOPPAN PRINTING CO LTD 发明人 TAKAGI NOBUO;KUBOTA KENTARO;YABUTA EIJI
分类号 H05K3/34 主分类号 H05K3/34
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