Method for manufacturing cover lay of printed circuit board

摘要

A method for manufacturing cover lay of printed circuit board is disclosed. With a method that includes preparing a board on which a circuit pattern is formed, and jetting a protecting ink selectively on the board by inkjet printing, a cover lay of a complicated shape may be formed easily with high accuracy and high productivity, as a polymer ink is jetted by inkjet printing to form the cover lay for a flexible circuit board.