| 摘要 |
A method for fabricating a wiring pattern (33) on a substrate (P) comprises the steps of: forming a first region (H1) corresponding to a formation region of the pattern, and a second region (H2) surrounding the first region, on the substrate; disposing a first function liquid (X1) on the first region; disposing a second function liquid (X2) on the first function liquid; and applying predetermined treatments to the first and the second function liquids which are disposed on the first region so as to form the pattern with plural materials stacked one on the other, wherein the second region has a liquid-repellency with respect to the first function liquid higher than that of the first region, the first and second function liquids include a conductive material. |
