METHOD FOR COATING RESIST ON BLANK MASK, BLANK MASK AND PHOTOMASK MANUFACTURED BY USING THE SAME

摘要

A resist coating method of a blank mask is provided to minimize attachment of resist to the back surface of a mask substrate by rotating the mask substrate at a low speed in a diffusion step before a high speed rotation or by accelerating the mask substrate for a predetermined time interval before a high speed rotation. A resist material is injected to a mask substrate(S610). The mask substrate is rotated while its rotation speed is varied, so that the resist material is diffused to the entire surface of the mask substrate. The diffusion process can include a low speed diffusion and a high speed diffusion. In the low speed diffusion, the mask substrate is rotated at a predetermined first rotation speed to diffuse the resist material to the mask substrate(S630). In the high speed diffusion, the mask substrate is rotated to a second rotation speed more than the first rotation speed to diffuse the resist material to the entire mask substrate(S640). The mask substrate is rotated to form a resist layer(S650). The mask substrate is rotated at a rotation speed less than that of the resist layer formation process to dry the resist layer formed on the mask substrate(S670).