DEVICE FOR COATING SEMICONDUCTOR WAFER USING PLATE-TO-PLATE PRINTING METHOD AND A METHOD FOR COATING SEMICONDUCTOR WAFER USING THE SAME DEVICE

摘要

A semiconductor wafer coating apparatus using a plate-to-plate print method is provided to avoid contamination of a wafer by preventing a coating liquid from being splashed or flowed to the outside. A pattern table(210) has a concave part(212) in which a shape to be printed on a semiconductor wafer(270) is intagliated. A coating liquid dispenser(220) supplies a coating liquid to the surface of the pattern table. A doctor blade(230) removes the coating liquid supplied to the surface of the pattern table except the intagliated shape in the concave part. A first actuator(225) controls the vertical and parallel transfer of the coating liquid dispenser and the doctor blade. A blanket roll(240) includes a blanket sheet(250) in which the coating liquid of the intagliated shape formed in the concave part of the pattern table is transferred to form an embossed shape. A blanket roll rotating motor rotates the blanket roll. A second actuator(260) controls the vertical and parallel transfer of the blanket roll. The blanket sheet can be fixed to one side of the blanket roll by a fixing apparatus.