发明名称 METHOD OF REDUCING WARPAGE IN AN OVER-MOLDED IC PACKAGE
摘要 A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of lines, or contiguous or spaced polygons, such as hexagons. Portions of the dummy circuit pattern may also be formed with an orientation, size and position that are randomly selected.
申请公布号 EP1905080(A1) 申请公布日期 2008.04.02
申请号 EP20060785812 申请日期 2006.06.28
申请人 SANDISK CORPORATION 发明人 TAKIAR, HEM;BHAGATH, SHRIKAR;WANG, KEN JIAN MING
分类号 H01L23/498;H01L23/538 主分类号 H01L23/498
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