| 摘要 |
According to one exemplary embodiment, a semiconductor die includes a memory core array situated over a substrate, where the memory core array includes a number of bitlines, where the bitlines can be situated in a first interconnect metal layer in the semiconductor die. The semiconductor die further includes an interconnect structure situated over the memory core array, where the interconnect structure is situated in a second interconnect metal layer in the semiconductor die and situated over each of the bitlines. The interconnect structure can include at least one interconnect line, which can form an angle with respect to the bitlines that can be greater than 0.0 degrees and less than or equal to 90.0 degrees. The interconnect structure can form one of a number of capacitances with each of the bitlines, where each of the capacitances can be substantially equal in value to each other of the capacitances. |
