| 摘要 |
A surface mount semiconductor device using a lead frame (1) is provided, which can suppress stress applied to a package by a load in a forming process performed for the lead frame (1) projecting from the package at a portion at which the lead frame (1) projects the package. Concave portions (10) are provided in a pair of leads (5, 7) that project laterally from side faces of a package. The concave portions (10) are arranged at positions where the leads (5, 7) are bent approximately perpendicularly along the side faces of the package at respective centers of the leads (5, 7) partially. Thus, cross-sectional areas of the bending portions of the leads (5, 7) can be reduced, thereby enabling the leads (5, 7) to be easily bent with a smaller bending load. Therefore, a surface mount semiconductor device can be achieved, which can prevent disconnection without impairing a heat radiation property and can have good moisture resistance. |
