| 摘要 |
688,172. Soldering and brazing. USINE GENEVOISE DE DEGROSSISSAGE D'OR. April 13, 1951 [April 21, 1950], No. 8632/51. Class 83 (iv). A soldering device comprises a malleable bimetallic plate which at least partly surrounds the members to be soldered, the inner layer of which clamps the members and the outer layer of which has a substantially lower melting-point and forms the solder. The inner layer of the bimetallic plate may be of copper, brass, nickel or their alloys and the outer layer which may be applied by hot plating may be a lead tin or silver alloy. One layer may be galvanically deposited on the other layer. The plate may be in the form of an open channel with layers 2, 3, Fig. 1, with perforations 4 through the inner layer 2, Fig. 4, or with perforations 4 through both layers 2, 3, Fig. 8, or the plate may be in the form of a tube. The inner and outer surfaces of the plate may be coated with an oxidation resistant metal, e.g. tin or silver. Flux, e.g. resin or borax, may be deposited on both surfaces of the plate and in the holes 4. The channel or tube is placed about the members to be butted or lapped and clamped to them by pliers and heated by an iron, flame or highfrequency coil. |
