| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composite sheet, a lamination part, and the manufacturing methods thereof wherein the decrease of the thickness of its insulation layer and the increase of the thickness of its wiring-conductor layer are satisfied at the same time, the simplification and contraction of its manufacturing process are made possible, and the generations of blow holes are suppressed in its conductor layer, and further, its adhesiveness is excellent. <P>SOLUTION: On the surface of a photo-transmissible carrier film 10, a conductor layer 11 having a predetermined pattern is formed out of a conductor paste, and a photo-curing slurry is so applied thereto by making its thickness larger than the thickness of the conductor layer 11 as to form a photo-curing ceramic layer 12. Thereafter, by projecting a light from the rear surface of the film 10, the photo-curing ceramic layer 12 present in the region other than the formed conductor layer 11 is so photo-cured and so developed as to create a composite sheet A comprising the photo-curing ceramic layer 12 and the conductor layer 11, wherein the surface of its ceramic layer comprises a rough surface having a surface roughness Rmax not smaller than 1 μm. By laminating these composite sheets A, there is formed such a laminated component as a multilayer circuit board having a three-dimension circuit comprising planar conductor layers and via conductors. <P>COPYRIGHT: (C)2004,JPO |
