| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip capable of effectively and easily preventing unsealing using a chemical agent or surface grinding and the like and illicit reading of circuit information and the like in the semiconductor chip. <P>SOLUTION: In this semiconductor chip 1, one or more recess parts 5 are formed on the back face of the semiconductor chip 1 having a circuit 3 constructed of a semiconductor element on the front face, and one or more through holes 6 are formed inside the recess parts 5, or alternatively, a groove 7 connected to the through hole 6 is formed. The semiconductor chip 1 is provided with a tapering projection 8 fixed at its tapered chip in the position facing the front face. The projection 8 is formed of a material having hardness equal to or higher than that of the semiconductor in the semiconductor chip 1. <P>COPYRIGHT: (C)2004,JPO |
