| 摘要 |
An electronic assembly (100) with a plurality of stacked integrated circuit (IC) die includes a base substrate (102), a first IC die (114B), a second IC die (114A), a signal routing first interconnect (140) and a signal routing second interconnect (120). The first interconnect (140) is partially positioned between the first and second IC dies (114B,114A). The second interconnect (120) is partially positioned adjacent the first side of the second IC die (114A). The first interconnect (140) couples a first contact of the first IC die (114B) to a first trace of the base substrate (102) and a second contact of the second IC die (114A) to a second trace of the base substrate (102). The first and second interconnects (140,120), in combination, couple the first contact of the second IC die (114A) to the first trace. |
