| 发明名称 |
Method for manufacturing semiconductor device and polishing apparatus |
| 摘要 |
In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid on a polishing target surface of the periphery.
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| 申请公布号 |
US7351131(B2) |
申请公布日期 |
2008.04.01 |
| 申请号 |
US20050178318 |
申请日期 |
2005.07.12 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKAMURA KENRO;MIYASHITA NAOTO;YODA TAKASHI;OKUMURA KATSUYA |
| 分类号 |
B24B1/00;B24B9/00;B24B9/06;B24B21/00;B24B21/06;H01L21/304;H01L21/321 |
主分类号 |
B24B1/00 |
| 代理机构 |
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代理人 |
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