| 摘要 |
A process for producing a thin film with MEMS probe circuits by using semiconductor process technology comprises steps of providing a flatted process substrate; forming a separable interface on the flatted process substrate; forming a probe circuit thin film with electric circuits, probes and circuit contacts on the separable interface; forming a raised probe supported-spacer on the probe circuit thin film; separating the probe circuit thin film from the process substrate; and processing a subsequent microstructure working to obtain a thin film with MEMS probe circuits which use the raised probe supported-spacer to form a buffer to prevent the probes from being exposed to much pressure.
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