发明名称 Methods of forming semiconductor device
摘要 A method of forming a semiconductor device includes forming a three-dimensional structure formed of a semiconductor on a semiconductor substrate, and isotropically doping the three-dimensional structure by performing a plasma doping process using a first source gas and a second source gas. The first source gas includes n-type or p-type impurity elements, and the second source gas includes a dilution element regardless of the electrical characteristic of a doped region.
申请公布号 US7351622(B2) 申请公布日期 2008.04.01
申请号 US20060490613 申请日期 2006.07.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BUH GYOUNG-HO;RYOO CHANG-WOO;SHIN YU-GYUN;PARK TAI-SU;LEE JIN-WOOK
分类号 H01L21/84;H01L21/00;H01L21/336;H01L21/8234 主分类号 H01L21/84
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