MACHINING METHOD OF PRINTED CIRCUIT BOARDS AND PRINTED CIRCUIT BOARD MACHINING APPARATUS

摘要

A machining method of a printed circuit board and a printed circuit board machining apparatus are provided to improve precision of a hole depth by compensating for a cut depth of a tool according to temperature rise of a principal axis unit. A machining method of a printed circuit board includes the steps of: previously obtaining a relationship between a driving time of a spindle and an axial direction displacement amount of a front end of a tool held on the spindle at each rotation number of the spindle; and compensating for a cut depth of the tool as much as the previously obtained displacement amount based on the rotation number of the spindle set for machining and an elapsed time after starting the machining.