发明名称 Methods and devices for enhancing bonded substrate yields and regulating temperature
摘要 Methods and devices that include the use of venting elements for enhancing bonded substrate yields and regulating temperature. Venting elements are generally fabricated proximal to functionalized regions in substrate surfaces to prevent bond voids that form during bonding processes from affecting the functionalized regions. Venting elements generally include venting channels or networks of channels and/or venting cavities.
申请公布号 US7351377(B2) 申请公布日期 2008.04.01
申请号 US20010884429 申请日期 2001.06.18
申请人 CALIPER LIFE SCIENCES, INC. 发明人 CHAZAN DAVID;BOUSSE LUC J.;BROOKS CARLTON;LOUCH DEREK;SPAID MICHAEL R.
分类号 B01L3/02;B01L3/00;B01L7/00;B81C3/00;G01L21/00;G01N27/26 主分类号 B01L3/02
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