WAFER SUPPORT PIN IN CAPABLE OF PREVENTING SLIP DURING THERMAL TREATMENT TO WAFER AND THERMAL TREATMENT METHOD TO WAFER

摘要

A wafer support pin and a method for annealing a wafer using the same are provided to minimize the stress resulted from gravity of the wafer by flattening or rounding a front end contacting the wafer. In a wafer support pin for supporting a bottom surface of a wafer when the wafer is annealed, a front end of the wafer support pin contacting the wafer is flat or rounded. The front end has a tapered shape, and a length(H2 or H3) of the tapered portion is 2 mm to 17 mm. The front end is made of a quartz material, single crystal material or polycrystal silicon material. If the front end is made of the single crystal material or polycrystal silicon material, the surface of the front end is coated by SiC or Si3N4.