APPARATUS FOR PACKING SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME

摘要

An apparatus for packing a semiconductor package and a method for the same are provided to improve packing speed by solving a bottleneck situation in a process at a supply unit having a first picker. An apparatus for packing a semiconductor package includes a supply unit(150) and a sorting unit(250). The supply unit has a plurality of first pickers(140) to supply a carrier tape(120) with an unsorted semiconductor before inputting the unsorted semiconductor package(110c) in a sorting device(170). The sorting unit has a plurality of second pickers(240) to sort a defective semiconductor package judged at the sorting device and to change the defective semiconductor package into the unsorted semiconductor package. Moving paths of the first and second pickers perpendicularly cross each other. Moving paths of the first pickers and the carrier tape perpendicularly cross each other. The moving paths of the second picker are in parallel with each other.