| 摘要 |
A semiconductor device having electronic blocks formed by independent manufacturing processes and a method for manufacturing the same are provided to overcome technical problems by forming independently core blocks and peripheral blocks. A semiconductor device includes at least one core block(CB), and at least one peripheral block. The core block includes a core wiring structure. The peripheral block includes a peripheral wiring structure connected electrically to the core wiring structure. The peripheral block is arranged at one surface of the core block. The core wiring structure has a cross section exposed from one surface of the core block. The exposed cross section of the core wiring structure comes in contact with an upper surface of the peripheral wiring structure.
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