| 摘要 |
A semiconductor device and a fabricating method thereof are provided to reduce a size in a thickness direction of the device by thinning an encapsulation resin formed on a semiconductor chip. A semiconductor device includes a semiconductor chip(15), an external connection terminal pad(18) electrically connected to the semiconductor chip, and an encapsulation resin(16) encapsulating the semiconductor chip. Wiring patterns(12,13) are provided between the semiconductor chip and the external connection terminal pad. The external connection terminal pad is placed on the wiring patterns. The semiconductor chip is flip-chip bonded to a portion of the wiring pattern which faces to the semiconductor chip. |
