| 摘要 |
A wafer level chip size package is provided to protect a semiconductor chip against the external shock by enclosing the rear side of the semiconductor chip with a cap, as well as making up for a thermal characteristic. A semiconductor chip(100) has a bonding pad(101), and a lower insulating layer(103) is formed on the semiconductor chip to expose the bonding pad. A redistribution layer(106) is formed on the lower insulating layer to be connected to the exposed bonding pad. An upper insulating layer(107) is formed on the lower insulating layer to expose a portion of the redistribution layer. A solder ball(108) is adhered to the exposed redistribution layer. A cap(109) is provided on one side of a groove corresponding to a size of the semiconductor chip to enclose the semiconductor chip. |
