| 摘要 |
An automatic wafer plating system is provided to easily remove a plating liquid and fine foreign substances adhered to the surface of a wafer returned to its original position after a plating process while using nitrogen gas by installing a buffer pusher in an elevation cap part the presses downward the wafer supported by an elastic support member of a plate bath and by installing a nitrogen gas injecting nozzle in the elevation cap part. In an automatic plating system, a stacked wafer(1a) with a surface to be plated is taken out from a loading apparatus(20) to a transfer apparatus(30) and the wafer is transferred to a plate bath of a plate part containing a refluxing plating liquid so as to be plated. The plated wafer is cleaned by using clean water and the cleaned wafer is dried. After the wafer with the surface to be plated is soaked into the plating liquid in the plate part to be plated, the plate liquid stuck to the surface of the plate wafer after the wafer is separated from the plate liquid is immediately removed by spray gas of high pressure by using a plating and plating liquid removing apparatus(500). After a cleaning and drying apparatus(600) adsorbs and rotates the processed wafer(1c) from which the plating and plating liquid are removed to be cleaned by water, the water on the surface of the cleaned wafer is dehydrated and dried at high rotation speed.
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