| 摘要 |
<p>A hot melt sealant/adhesive composition is provided which comprises the following components-Component A. a siloxane polymer composition comprising a) An organopolysiloxane which may comprise not less than two groups selected from i) silicon bonded alkenyl groups or ii) silicon-bonded hydroxyl groups and/or silicon bonded hydrolysable groups b) one or more fillers; and a cure system comprising c) a suitable catalyst and where required d) a suitable cross-linker adapted to react with component (a), catalysed with component (c) ; and either or both of components B. and C. wherein:-B. is one or more hot melt resins; and C. is one or more waxes having a melt temperature of between 40 and 200‹C; and/or an organic resin having a viscosity average molecular weight of from 200 to 6000 and a softening point of from O‹C and 15O‹C; wherein the total amount of components B and/or C in the composition is from 2 to 60% by weight of the whole composition. ® KIPO & WIPO 2008</p> |
