Printed circuit for electronic device, has support with thermal expansion coefficient along axis perpendicular to support, which is less than specific micrometer per meter per centigrade, for temperature domain less than specific degrees

摘要

The circuit (101) has a support (102) made of an insulating material and covered on its two faces by an insulation layer (107). The support has a thermal expansion coefficient along an axis perpendicular to the support, which is less than 55 micrometer per meter per centigrade, for a temperature domain less than 150 degrees. External lands (103, 104) comprise parts that are exposed to a weld having a width less than 0.3 millimeter. The circuit has inner conductive lands electrically connected to a conductive track, when the conductive lands are located at interior of the support. An independent claim is also included for an electronic circuit comprising electronic components and a printed circuit.