| 发明名称 |
COPPER ALLOY FOR ELECTRONIC EQUIPMENT AND PROCESS FOR PRODUCING THE SAME |
| 摘要 |
A copper alloy for electronic equipment, characterized in that the work-affected layer constituting the surface layer thereof has a thickness of 0.2 mum or less; and a process for producing the same. ® KIPO & WIPO 2008 |
| 申请公布号 |
KR20080027818(A) |
申请公布日期 |
2008.03.28 |
| 申请号 |
KR20087000123 |
申请日期 |
2006.07.04 |
| 申请人 |
THE FURUKAWA ELECTRIC CO., LTD. |
发明人 |
UNO TAKEO;SUGAHARA CHIKAHITO;MIHARA KUNITERU |
| 分类号 |
C22C9/02;C22C9/04;C22F1/02;C22F1/08 |
主分类号 |
C22C9/02 |
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