发明名称 SHEET FOR FORMING PROTECTING FILM FOR CHIP
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a sheet for forming a protecting film for a chip in which the protecting film of high uniformity can be easily formed on the rear side of the chip, and further, even if fine flaws are formed on the rear side of the chip by mechanical grinding, adverse influences caused by such flaws can be canceled. <P>SOLUTION: A sheet 10 for forming the protecting film for the chip includes a release sheet 1 and a protecting film forming layer 2 which is formed on the release side of the release sheet 1 and constituted of a thermosetting component and/or an energy ray curing component and a binder polymer component. The binder polymer component is constituted of an acrylic polymer, the thermosetting component is constituted of an epoxy resin, and the energy ray curing component is constituted of an ultraviolet curing resin, preferably. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008072108(A) 申请公布日期 2008.03.27
申请号 JP20070227579 申请日期 2007.09.03
申请人 LINTEC CORP 发明人 SENOO HIDEO;SUGINO TAKASHI;YAMAZAKI OSAMU
分类号 H01L21/301;C09J4/02;C09J7/02;C09J133/00;C09J163/00;H01L21/683 主分类号 H01L21/301
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