| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To achieve improvement an electrical connection mechanism between a first semiconductor and a metal sheet of a photoelectric converter provided with a supporting body provided, at its hole part, with a photoelectric converting element including a first spherical semiconductor and a second semiconductor layer covering the surface of the first semiconductor and with a metal sheet bonded to the rear surface of the supporting body via an electrical insulating layer, and to achieve rationalization of its manufacturing process. <P>SOLUTION: In the photoelectric converter, a conductor bump 7 formed in the exposed area of a first semiconductor 1 facing to the rear surface side of a supporting body or on an electrode on the exposed area is inserted with pressure into the electrical insulating layer as a penetrated bump and the front end thereof is abutted to the metal sheet under the pressurized condition. The conductor bump is preferably formed in the conical or pyramidal shape and is abutted to the metal sheet through plastic deformation by application of pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
