| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve flatness of a MEMS device so that mating faces of the MEMS device and substrate are joined by using an adhesive. <P>SOLUTION: A method for gluing the MEMS device to the substrate in order to form a MEMS device assembly comprises the steps of: measuring at least one of a thickness profile S100a of the MEMS device and flatness S100b of the mating face of the substrate; S110 applying the adhesive on at least one of the mating face of the MEMS device and mating face of the substrate; and S120 joining the mating faces of the MEMS device and substrate so that the adhesive makes the MEMS device and substrate glue. An amount of the adhesive applied on one of two mating faces or both mating faces is selected so as to compensate the thickness profile of the MEMS device and the locally fluctuated flatness of the mating face of the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
