发明名称 A HEAT SINK DEVICE AND A COOLING STRUCTURE
摘要 <p>A heat sink and a cooling structure using the heat sink are disclosed. The heat sink of the present invention includes a heat absorbing part (102), which is provided at a predetermined position on a main body (100) and is in contact at an end thereof with a heat source to absorb heat from the heat source. A plurality of through holes (106) is formed in the main body (100) such that they extend from an inlet surface (104) of the main body to an outlet surface (105) opposite the inlet surface, so that heat absorbed into the main body through the heat absorbing part is transferred to air that flows through the through holes.</p>
申请公布号 WO2008035930(A1) 申请公布日期 2008.03.27
申请号 WO2007KR04586 申请日期 2007.09.19
申请人 LIM, JAEYOUNG 发明人 LIM, JAEYOUNG
分类号 G06F1/20 主分类号 G06F1/20
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